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Interconnect Technology - Electro-Deposited Copper Foil

We use the most advanced production equipment, and the main process is produced in a clean room to control the stability of the copper foil. In terms of product planning, we have currently mass-produced 4oz, 3oz, 2oz, 1oz, 1/2oz, 1/3oz, and 9µm copper foil. , and has developed high-quality copper foil products such as 7µm ultra-thin copper foil, VLP (Very Low Profile), RTF (Reverse Treatment Foil), 2RT (Very low profile RTF), etc. Its product features are as follows:


  • The main process of the production line is controlled by clean rooms to ensure environmental quality.
  • Use more than 99.9% high-purity copper raw materials to ensure the quality of copper foil
  • The purity of the electrolyte in the process is passed through a multi-channel ultra-precision filtration system to completely remove impurities in the solution.
  • The manufacturing process adopts DCS control, with good manufacturing process design and high operating efficiency.
  • We have independent R&D and testing production machines to quickly develop products to meet customer needs.


Our technical and R&D team has more than 20 years of professional experience and technology in copper foil manufacturing, and can provide high-quality, high-reliability customized copper foil for the printed circuit board industry (PCB) and copper foil substrate industry (CCL) .


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Advantage

  • High quality production line environment
  • Copper raw material is of high purity, reaching more than 99.9%
  • The process electrolyte is highly clean and completely free of impurities
  • Manufacturing process is well designed and efficient
  • Can quickly develop products to meet customer customized needs

Product Categories

Solutions

High-Density & High-Speed Materials
High-Frequency & High-Speed Materials
Precision Die-Casting

FAQ

What types of electrolytic copper foil does LCYT offer? Are they suitable for 5G or AI servers?

LCYT provides a comprehensive range of electrolytic copper foil solutions covering both standard and advanced applications:

  1. Standard Copper Foil (HTE): Suitable for general PCBs, automotive boards, and consumer electronics, offering excellent physical properties.
  2. Reverse Treated Foil (RTF/RTF2): Designed for HDI and high‑layer‑count boards. Through specialized nodular treatment technology, it delivers better electrical performance and efficiency compared to standard foil.
  3. High‑Frequency, High‑Speed Copper Foil (HVLP/VLP): Our flagship products developed specifically for 5G communications, AI servers, and high‑frequency networking equipment.

Regarding 5G and AI servers:

We offer corresponding HVLP series products. These foils feature ultra‑low surface roughness (Low Rz), significantly reducing signal loss and fully meeting the stringent electrical requirements of PCIe Gen 5/6 and AI server mainboards (Mainboard/OAM/UBB).

How do LCYT’s copper foils perform in terms of surface roughness (Rz) and peel strength? Is there competitive benchmarking data available?

Through proprietary electroplating formulations and surface‑treatment technologies, LCYT achieves an excellent balance between low roughness and high peel strength:


Roughness (Rz): The RTF series can be controlled below 3.0–4.0 µm; the high‑end HVLP series can reach 2.0 µm or even lower to support high‑speed signal‑transmission needs.

Peel Strength: Even at extremely low roughness levels, our foils maintain outstanding peel strength to ensure reliability after multiple lamination cycles.


Competitive comparison:

We maintain a comprehensive competitor benchmarking database and can recommend equivalent LCYT models. If you provide your current technical specifications, we can perform precise model mapping for you.

What thickness range and width specifications are available for LCYT copper foils?

  • Thickness Range: We offer an extensive production range—from ultra‑thin 9 µm and 12 µm foils (for advanced HDI/CCL) to standard 18 µm and 35 µm, and even thick copper foils such as 70 µm and 105 µm (for high‑current/automotive applications). We have dedicated process optimization for 9 µm and 12 µm products.
  • Width Specifications: Standard mother‑roll width is approximately 1280–1295 mm. Custom slitting services are available, allowing us to cut precisely to the width you require. Please contact our sales team for detailed specifications.

Does LCYT supply cut copper foil? What are the acceptable cutting‑width ranges?

Yes. LCYT offers flexible supply formats, providing two types of cutting services:


Slit Rolls: Slitting to customer‑specified widths, suitable for continuous automated production lines.

Cut Sheets: For sample prototyping or special processing needs, we also offer sheet‑cut formats (e.g., 650 mm × 650 mm or other specified dimensions).


Specification limits:

Minimum and maximum widths depend on foil thickness and packaging requirements. If you have specific cutting tolerances or packaging needs (e.g., paper‑core size or special packaging), please inform our sales representative so we can evaluate feasibility.

What is the lead time for LCYT standard products? Do you accept customized specifications?

Standard Lead Time: Typically 2–4 weeks (14–28 days) for standard specifications such as HTE/RTF.


Special Conditions: During peak demand periods or when HVLP production capacity is tight (e.g., AI‑driven demand surges), lead time may extend to 4–6 weeks or more. We recommend placing forecasts 4–6 weeks in advance for long‑lead‑time items.


Customized Specifications: We support product customization and can collaborate through JDM (Joint Design Manufacture) development. Lead time for customized products depends on R&D and pilot‑production schedules, typically starting from 4–6 weeks.